Company Filing History:
Years Active: 2018
Title: The Innovative Contributions of Li-Song Lin
Introduction
Li-Song Lin is a notable inventor hailing from Nantou, Taiwan. With a keen interest in thermal management technologies, he has made significant contributions to the field. Lin holds one patent, underscoring his innovative spirit and technical expertise.
Latest Patents
Lin's most recognized patent is for a Power Heat Dissipation Device. This innovative device includes a heat-conducting layer that features both a heat-absorbing surface and a heat-dissipating surface. In this structure, a heat sink is placed in thermal contact with the heat-dissipating surface, with a dedicated heat-conducting section formed within the heat sink. Additionally, the device incorporates at least one cooling chip, which is embedded within the heat sink and positioned next to the heat transferring channel. The cooling chip has a surface that is perpendicular to the heat-absorbing surface, effectively allowing it to remove excess heat efficiently.
Career Highlights
Li-Song Lin is affiliated with the Industrial Technology Research Institute, where he plays a crucial role in advancing research and development projects. His work focuses on improving thermal management systems, reflecting his commitment to creating effective solutions for heat dissipation issues.
Collaborations
Throughout his career, Lin has collaborated with esteemed colleagues, including Po-Hua Chang and Min-Chuan Wu. His teamwork and collaborative spirit have contributed to the success of the inventions and innovations coming from the Industrial Technology Research Institute.
Conclusion
Li-Song Lin's contributions to the field of thermal management through his patented Power Heat Dissipation Device demonstrate the importance of innovative thinking in engineering. His work not only showcases his technical abilities, but also highlights the value of collaboration within the research community. Lin exemplifies how inventors can fuel advancements that drive technology forward, revealing the potential for future innovations in heat dissipation and beyond.