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Years Active: 2024
Title: Innovations of Li-kun Liu in Circuit Board Technology
Introduction
Li-kun Liu is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of circuit board technology. His innovative designs focus on reducing electromagnetic interference, which is crucial for enhancing the performance of electronic devices.
Latest Patents
Li-kun Liu holds a patent for a circuit board and method for manufacturing the same. This circuit board features built-in protection against incoming and outgoing electromagnetic interference (EMI). It includes an insulating adhesive portion, a first signal line, and a second signal line. The first and second signal lines are surrounded and separated by an electromagnetic shielding film against EMI. The insulating adhesive portion fills gaps between the first signal line and the electromagnetic shielding film, as well as between the second signal line and the electromagnetic shielding film. This design effectively reduces external interference with signals, minimizes mutual interference between the signal lines, and decreases electromagnetic radiation from the circuit board.
Career Highlights
Throughout his career, Li-kun Liu has worked with several prominent companies. He has been associated with Hongqisheng Precision Electronics Co., Ltd. and Avary Holding (Shenzhen) Co., Limited. His experience in these organizations has contributed to his expertise in circuit board technology.
Collaborations
Li-kun Liu has collaborated with talented individuals in his field, including Yang Li and Yan-lu Li, who is a woman. These collaborations have likely enriched his work and led to further innovations in circuit board design.
Conclusion
Li-kun Liu's contributions to circuit board technology demonstrate his commitment to innovation and excellence. His patent for a circuit board with enhanced EMI protection showcases his ability to address critical challenges in electronics. His work continues to influence the industry and pave the way for future advancements.