Company Filing History:
Years Active: 2018-2019
Title: Leung Kway Lee: Innovator in Electrostatic Carriers and Metal Nitride Processing
Introduction
Leung Kway Lee is a notable inventor based in Sunnyvale, California. He has made significant contributions to the field of electrostatic carriers and metal nitride processing. With a total of 2 patents to his name, his work has advanced the technology used in substrate transfer and processing methods.
Latest Patents
One of Leung's latest patents is for a Transparent Electrostatic Carrier. This invention provides an electrostatic carrier designed for transferring a substrate, featuring a transparent body. The transparent body includes a first surface that is sized to transport the substrate into and out of a processing chamber. Additionally, the electrostatic carrier is equipped with one or more electrostatic chucking electrodes that are coupled to the transparent body. These electrodes may utilize a transparent conductive oxide material, such as indium-tin oxide.
Another significant patent is for the Selective Etch of Metal Nitride Films. This processing method involves oxidizing a metal nitride film to create a metal oxynitride layer, which is then etched using a metal halide etchant. The etchant can include materials like WCl, WOCl, or TaCl. The method also describes techniques for filling a trench with a seam-free gapfill, ensuring efficient processing.
Career Highlights
Leung Kway Lee is currently employed at Applied Materials, Inc., where he continues to innovate in his field. His work has been instrumental in developing advanced technologies that enhance substrate processing and transfer.
Collaborations
Leung has collaborated with notable coworkers, including Liqi Wu and Wenyu Zhang. Their combined expertise has contributed to the success of various projects and patents.
Conclusion
Leung Kway Lee is a distinguished inventor whose work in electrostatic carriers and metal nitride processing has made a significant impact in the industry. His innovative patents reflect his commitment to advancing technology in substrate transfer and processing methods.