Endwell, NY, United States of America

Leroy N Chellis


Average Co-Inventor Count = 1.4

ph-index = 5

Forward Citations = 131(Granted Patents)


Company Filing History:


Years Active: 1980-1992

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6 patents (USPTO):Explore Patents

Title: Leroy N Chellis: Innovator in Flame Retardant Technologies

Introduction

Leroy N Chellis is a notable inventor based in Endwell, NY (US). He has made significant contributions to the field of materials science, particularly in the development of flame retardant technologies. With a total of 6 patents to his name, Chellis has demonstrated a commitment to innovation and practical applications in his work.

Latest Patents

One of Chellis's latest patents is for a flame retardant, low dielectric constant microsphere filled laminate. This invention involves a prepreg material that includes randomly distributed silane coated hollow microspheres. The material is designed to be low cost and has a controlled coefficient of thermal expansion. Laminates made from this prepreg can be drilled cleanly for through holes, making them suitable as substrates for surface-mounted devices. Another significant patent is for a process that provides a landless through-hole connection. This process allows for the electrical connection of at least two conductors through a dielectric material, enhancing the efficiency and reliability of electronic components.

Career Highlights

Chellis is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and contribute to advanced technologies. His work at IBM has positioned him as a key player in the development of materials that enhance the performance and safety of electronic devices.

Collaborations

Throughout his career, Chellis has collaborated with notable coworkers such as Theron L Ellis and Robert Maynard Japp. These collaborations have further enriched his work and contributed to the success of his inventions.

Conclusion

Leroy N Chellis is a distinguished inventor whose work in flame retardant technologies has made a significant impact in the field of materials science. His innovative patents and contributions to IBM highlight his dedication to advancing technology and improving safety in electronic applications.

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