Company Filing History:
Years Active: 1987
Title: Leroy E Bond: Innovator in Composite Materials
Introduction
Leroy E Bond is a notable inventor based in Rochester, NH (US). He has made significant contributions to the field of composite materials, particularly in enhancing their structural integrity and flexibility. His innovative work is particularly relevant in high-temperature and high-stress environments.
Latest Patents
Leroy E Bond holds a patent for a composite that boasts improved transverse structural integrity. This composite features randomly oriented high-temperature resistant inorganic fibers that are interlocked into a shape-sustaining paper. The design includes a transverse thickness ranging from about 0.005 to 0.5 inches. A high-temperature resistant, flexible fabric made of inorganic fibers is applied to at least one surface of the paper. An organic adhesive is used to bond the paper to the fabric, creating a composite that is flexible enough to be folded or pleated without breaking. This innovation allows the composite to withstand high temperatures and transverse stresses without rupturing.
Career Highlights
Leroy E Bond has dedicated his career to advancing materials science, particularly through his work at Lydall, Inc. His focus on developing composites with enhanced properties has positioned him as a key figure in the industry. His patent reflects his commitment to innovation and the practical applications of his research.
Collaborations
Throughout his career, Leroy has collaborated with notable colleagues, including William H Cambo and Elliott F Whitely. These partnerships have contributed to the development of advanced materials and have fostered a collaborative environment for innovation.
Conclusion
Leroy E Bond's contributions to composite materials demonstrate his expertise and commitment to innovation. His patented work not only enhances the performance of materials but also opens new possibilities for their application in demanding environments. His career serves as an inspiration for future inventors in the field.