Leong Tee Koh

Title: Innovations by Leong Tee Koh in Microelectronics

Introduction

Leong Tee Koh is a prominent inventor based in Johor Bahru, Malaysia. He has made significant contributions to the field of microelectronics, particularly in the development of advanced lithography techniques. With a total of two patents to his name, his work has been instrumental in pushing the boundaries of semiconductor manufacturing.

Latest Patents

Leong Tee Koh's latest patents include innovative processes for dual damascene fabrication. The first patent, titled "Bi-layer resist process for dual damascene," introduces e-beam patterning techniques for creating contact and via holes with diameters as small as 0.05 microns. This method utilizes a combination of conventional I-line or deep UV resist for trench patterns and e-beam lithography for contact and via hole patterns. The second patent, "Tri-layer resist method for dual damascene process," describes a process where a three-layer composite insulation is deposited, followed by trench etching and hard baking. This method enhances the efficiency of dual damascene structure formation.

Career Highlights

Leong Tee Koh is associated with the Institute of Microelectronics, where he has been involved in cutting-edge research and development. His expertise in lithography and semiconductor processes has positioned him as a key figure in the industry. His innovative approaches have garnered attention and respect among peers in the field.

Collaborations

Leong Tee Koh has collaborated with notable colleagues, including Rakesh Kumar and Pang Dow Foo. These collaborations have further enriched his research and contributed to the advancement of microelectronics.

Conclusion

Leong Tee Koh's contributions to microelectronics through his innovative patents and collaborative efforts highlight his significant role in the field. His work continues to influence the future of semiconductor manufacturing and technology.