Austin, TX, United States of America

Lei Ping Lai


Average Co-Inventor Count = 2.8

ph-index = 4

Forward Citations = 129(Granted Patents)


Location History:

  • Glendale, AZ (US) (1997)
  • Austin, TX (US) (1999 - 2001)

Company Filing History:


Years Active: 1997-2001

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4 patents (USPTO):Explore Patents

Title: **Inventor Lei Ping Lai: Pioneering Advancements in Chemical Mechanical Polishing**

Introduction

Lei Ping Lai is an accomplished inventor based in Austin, TX, known for his significant contributions to the field of chemical mechanical polishing (CMP) for semiconductor fabrication. With four patents to his name, he has played a crucial role in developing methods and apparatuses that enhance the efficiency and effectiveness of polishing substrates, particularly semiconductor wafers.

Latest Patents

Among his notable innovations, Lei Ping Lai's latest patents include a **Retaining Ring for Chemical Mechanical Polishing**. This invention addresses the critical need for effective substrate retention during the CMP process, ensuring improved polishing uniformity, especially at the wafer periphery. The retaining rings designed by Lei feature unique surface characteristics, such as recesses and protrusions, which facilitate better contact with the CMP polishing pad. These enhancements not only optimize the flattening process of the polishing pad beneath the substrate but also improve slurry transport during polishing.

Another groundbreaking patent is the **Process for Forming a Semiconductor Device**, which focuses on in-situ and ex-situ conditioning of polishing pads. This dual approach allows for effective conditioning while the substrate is still on the polishing pad, leading to significant improvements in polishing outcomes.

Career Highlights

Throughout his career, Lei Ping Lai has made substantial impacts while working with renowned companies such as Motorola Corporation and Samsung Austin Semiconductor. His experience in these organizations has equipped him with the technical expertise and innovative mindset required to excel in the semiconductor industry.

Collaborations

Lei has collaborated with notable colleagues, including Sung C. Kim and Joshua L. Tucker. These partnerships have fostered a collaborative environment that promotes the sharing of ideas and advancements in CMP technologies.

Conclusion

Lei Ping Lai stands out as a prominent inventor in the semiconductor industry, with a promising portfolio that reflects his dedication to innovation in chemical mechanical polishing. His cutting-edge patents continue to influence the efficiency of semiconductor fabrication processes, making him a significant figure in the realm of technological advancements.

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