Lei Liu

Title: Lei Liu: Innovator in 3D Printing and Heat Transfer Technologies

Introduction

Lei Liu is a prominent inventor based in Shaanxi, China. He has made significant contributions to the fields of 3D printing and heat transfer technologies. With a total of 2 patents, his work showcases innovative solutions that address contemporary engineering challenges.

Latest Patents

One of Lei Liu's latest patents is the "Boron-containing titanium-based composite powder for 3D printing and method of preparing same." This invention discloses a boron-containing titanium-based composite powder for 3D printing, consisting of 0.5%-2% by weight of titanium diboride and 98%-99.5% by weight of titanium sponge. The invention further discloses a method of preparing such composite powder, where the element boron is introduced to the titanium powder through rapid solidification. This process significantly improves the solid solubility of boron in titanium, enabling the introduction of part of the boron into the titanium matrix to form supersaturated solid solutions. The reinforcement phase TiB in the boron-containing titanium-based composite powder can be precisely controlled in grain size, ranging from the nanometer scale to the micrometer scale, through temperature or energy density. This allows for the preparation of titanium-based composite materials with different sizes of reinforcement phases to meet various mechanical requirements.

Another notable patent is the "Loop heat pipe with vapor-liquid two-phase flow injector." This invention includes an evaporator, a vapor-liquid two-phase flow injector, a boiling pool, and a condenser. The two-phase flow injector has a central vapor inlet and a circumferential liquid inlet, connecting to an outlet of the evaporator and an inlet of the boiling pool. The condensate inlet of the condenser is connected to an outlet of the boiling pool, while an outlet of the condenser is connected to the evaporator. This innovative design allows for the direct introduction of a portion of the supercooled liquid working medium to the boiling pool without passing through the evaporator. This solution addresses the problem of insufficient liquid supply for the boiling pool and increases the driving force for system operation, enabling efficient cooling of electronic devices and long-distance heat transfer.

Career Highlights

Lei Liu has worked at notable institutions such as Xi'an University of Technology and Xi'an Jiaotong University. His experience in these academic environments has contributed to his development