Company Filing History:
Years Active: 1993
Title: Lee P Springer: Innovator in Polymer Science and Dielectrics
Introduction
Lee P Springer, an accomplished inventor based in Endicott, NY, is recognized for his significant contributions to the field of polymer science. With two patents to his name, he has made remarkable advancements in high-impact strength resins and dielectrics, demonstrating a unique blend of innovation and practical application.
Latest Patents
Springer's latest patents include:
1. **Mechanically Enhanced, High Impact Strength Triazine Resins**: This invention focuses on filled poly(triazine) resin dielectrics and microelectronic circuit packages. The resin compositions incorporate dispersed thermoplastic polymeric fillers which enhance the ductility of triazine polymers while maintaining a low dielectric constant, ultimately improving the materials' practical application in electronic components.
2. **Adhesives on Polyimide Films and Methods of Preparing Them**: This patent details a polymeric product comprising diglycidyl bis phenol p-dialkyl benzene and dicyanate diphenyl hexafluoro isopropane. The invention highlights an organic polymeric dielectric composite that enhances the structural integrity of electronic circuit packages and supports microelectronic circuit chips.
Career Highlights
Lee P Springer currently works at International Business Machines Corporation (IBM), a global leader in technology and innovation. His work has played a crucial role in the advancements of materials utilized in the electronics sector, with a keen focus on improving the performance of dielectric materials.
Collaborations
Throughout his career, Springer has collaborated with notable colleagues, including Ashit A Mehta and William J Summa. Their collective expertise has fostered an environment of innovation within the realm of material sciences, particularly in enhancing the properties of resins and polymers.
Conclusion
Lee P Springer is a distinguished inventor whose contributions have greatly impacted the field of polymer science. With his innovative patents, he continues to push boundaries at IBM, proving that advancements in materials technology are pivotal for the evolution of microelectronics and circuit design. His commitment to innovation serves as an inspiration to future inventors in the industry.