Location History:
- Va. Beach, VA (US) (1990)
- Virginia Beach, VA (US) (1992)
- Austin, TX (US) (1989 - 1993)
Company Filing History:
Years Active: 1989-1993
Title: The Innovative Contributions of Lawrence N. Smith
Introduction
Lawrence N. Smith is a prominent inventor based in Austin, Texas, known for his significant contributions to the field of microelectronics. With a total of eight patents to his name, Smith has made remarkable advancements in customizable interconnect circuits and other technologies.
Latest Patents
One of his latest patents is titled "Substrate interconnect allowing personalization using spot surface links." This invention features a customizable interconnect circuit that utilizes a universal substrate with a minimum number of layers. The design allows for programmable conductive links to be placed solely on the top layer of the substrate. This innovative circuit boasts a high density of orthogonally placed X- and Y-conductors, which are capable of interconnecting closely spaced large-scale integrated circuits or discrete electrical components. By employing a series of interconnect cells that are regularly spaced throughout a universal, fixed substrate, the routing of interconnects from overlying electrical components or integrated circuits can be directed more efficiently to target areas.
Career Highlights
Lawrence N. Smith is currently associated with the Microelectronics and Computer Technology Corporation, where he continues to push the boundaries of technology. His work has been instrumental in advancing the capabilities of microelectronics, particularly in the area of customizable circuits.
Collaborations
Throughout his career, Smith has collaborated with notable colleagues, including Curtis Nathan Potter and Harry Kroger. These partnerships have contributed to the development of innovative solutions in the field.
Conclusion
Lawrence N. Smith's contributions to microelectronics and his innovative patents highlight his role as a leading inventor in the industry. His work continues to influence the future of customizable interconnect technologies.