Lavoie R Millican

Title: Lavoie R Millican: Innovator in Integrated Circuit Technology

Introduction

Lavoie R Millican is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of integrated circuit technology, particularly through his innovative patent that addresses challenges in solder bump reflow processes.

Latest Patents

Millican holds a patent for a method of reflowing solder bumps after probe testing. This patent describes a technique where an integrated circuit die is tested by inserting test probe needles into flat solder pads before reflow. The testing is conducted at various temperatures to functionally assess the integrated circuit die. The design of flat solder pads during the probe test enhances the uniform contact point and pressure for the test probes, minimizing the risk of slippage or sliding. The probe needles may create indentations in the solder pads, but the reflow process following the probe test effectively removes these indentations, resulting in rounded solder bumps that are free from probe damage. These solder bumps are essential for flip-chip interconnecting the integrated circuit into end-user systems.

Career Highlights

Millican is associated with Motorola Corporation, where he has applied his expertise in integrated circuit technology. His work has contributed to advancements in the manufacturing and testing of integrated circuits, showcasing his commitment to innovation in the field.

Collaborations

One of Millican's notable coworkers is Vern H Winchell, II. Their collaboration reflects a shared dedication to enhancing technology in the semiconductor industry.

Conclusion

Lavoie R Millican's contributions to integrated circuit technology through his innovative patent demonstrate his significant role in advancing the field. His work continues to impact the way integrated circuits are tested and manufactured, ensuring improved performance and reliability in electronic systems.