Laura A Principe

Title: Laura A. Principe: Innovator in Chip Package Fabrication

Introduction

Laura A. Principe is a notable inventor based in Charlton, NY (US). She has made significant contributions to the field of chip package fabrication, holding 2 patents that showcase her innovative approach to technology.

Latest Patents

Laura's latest patents include a "System of Chip Package Build-Up" and a "Method of Chip Package Build-Up." Both patents disclose a system and method for chip package fabrication. The chip package features a base re-distribution layer with an opening, an adhesive layer with a window free of adhesive material, and a die affixed to the base re-distribution layer. The die is aligned with the window, ensuring that only its perimeter contacts the adhesive layer. A shield element is strategically positioned between the base re-distribution layer and the adhesive layer, aligned with the opening and window. This design allows for an air gap between the shield element and the die, and the shield can be selectively removed to expose the die's front surface.

Career Highlights

Laura A. Principe is currently employed at General Electric Company, where she continues to innovate in her field. Her work has contributed to advancements in chip packaging technology, enhancing the efficiency and effectiveness of electronic devices.

Collaborations

Laura has collaborated with notable coworkers such as Paul Alan McConnelee and Kevin Matthew Durocher. Their teamwork has fostered an environment of innovation and creativity within their projects.

Conclusion

Laura A. Principe stands out as a pioneering inventor in chip package fabrication. Her contributions through her patents and work at General Electric Company highlight her commitment to advancing technology in this critical area.