Company Filing History:
Years Active: 2011
Title: Lau Choong Keong: Innovator in Wafer Level Packaging
Introduction
Lau Choong Keong is a notable inventor based in Perak, Malaysia. He has made significant contributions to the field of semiconductor technology, particularly in wafer level packaging. His innovative approach has led to the development of a unique method that enhances the efficiency and effectiveness of semiconductor devices.
Latest Patents
Lau holds a patent for a "Wafer level package using stud bump coated with solder." This patent describes a method for fabricating a wafer level package, which includes the fabrication of at least one active device on a semiconductor wafer that has not been singulated. The active device features a plurality of bonding pads exposed at the upper surface of the wafer. Before the semiconductor wafer is singulated, a plurality of corresponding stud bumps on the bonding pads are formed using a wire bonding tool. Subsequently, a molding encapsulation layer is applied over the semiconductor wafer, leaving an upper portion of each stud bump exposed. This innovative method streamlines the manufacturing process and improves the performance of semiconductor devices.
Career Highlights
Lau Choong Keong is currently employed at Carsem (M) Sdn. Bhd., where he continues to work on advancing semiconductor technologies. His expertise in wafer level packaging has positioned him as a key player in the industry. Lau's dedication to innovation is evident in his work and the impact it has on the field.
Collaborations
Lau has collaborated with several talented individuals in his field, including coworkers Lily Khor and Yong Lam Wai. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Lau Choong Keong is a prominent inventor whose work in wafer level packaging has made a significant impact on the semiconductor industry. His innovative methods and dedication to his craft continue to inspire advancements in technology.