Stockholm, Sweden

Lars Engblom


 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Lars Engblom: Innovator in Printed Board Assembly Technology

Introduction: Lars Engblom is a notable inventor based in Stockholm, Sweden. He has made significant contributions to the field of printed board assembly, particularly in MicroTCA systems. His innovative approach has led to the development of a unique method that enhances the functionality and efficiency of printed circuit boards.

Latest Patents: Lars Engblom holds 1 patent for his invention related to printed board assembly. This patent describes a method and assembly that incorporates backplane pin connectors designed to interface seamlessly with receiving connectors of a backplane interconnect. The invention features a switch unit with physical output/input ports that can be assigned logical port numbers, optimizing the routing of conductive threads to prevent crossover while ensuring effective shielding against crosstalk.

Career Highlights: Engblom is currently associated with Telefonaktiebolaget LM Ericsson (publ), a leading telecommunications company. His work focuses on advancing technologies that improve communication systems and enhance the performance of electronic devices.

Collaborations: Throughout his career, Lars has collaborated with esteemed colleagues, including Mats Johansson and Peter Scott. These partnerships have fostered an environment of innovation and have contributed to the successful development of cutting-edge technologies.

Conclusion: Lars Engblom's contributions to printed board assembly technology exemplify the spirit of innovation in the telecommunications industry. His work continues to influence advancements in electronic communication systems, showcasing the importance of inventive minds in shaping the future.

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