Company Filing History:
Years Active: 1994-2005
Title: Larry William Houk: Innovator in Thermal Management Solutions
Introduction
Larry William Houk is a notable inventor based in Kokomo, IN (US). He has made significant contributions to the field of thermal management through his innovative designs and patents. With a total of 2 patents, Houk has focused on improving the reliability and efficiency of electronic components.
Latest Patents
Houk's latest patents include a heatsink buffer configuration and a bond pad with a patterned bonding surface. The heatsink buffer configuration features a backplate that defines a heat transfer passage, with a thermally conductive buffer element positioned within to provide an effective thermal conduit. The bond pad invention aims to enhance the reliability of bond joints between surface-mounted integrated circuit packages and conductors on circuit board substrates. This design prevents the bond pad from being placed upside down, which could lead to material mismatches, ensuring that only properly oriented bond pads are used during assembly.
Career Highlights
Throughout his career, Larry William Houk has worked with prominent companies such as Delco Electronics Corporation and Delphi Technologies, Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas in thermal management.
Collaborations
Houk has collaborated with notable coworkers, including Kevin E McClure and Thomas P Douglas, contributing to the advancement of technology in their respective fields.
Conclusion
Larry William Houk's contributions to thermal management through his patents and career experiences highlight his role as an influential inventor. His work continues to impact the reliability and efficiency of electronic components in various applications.