Hong Kong, China

Lanyue Dou


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Lanyue Dou: Innovator in Thermal Management Solutions

Introduction

Lanyue Dou is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of thermal management through his innovative designs and patents. His work focuses on enhancing the efficiency of heat sinks, which are critical components in various electronic devices.

Latest Patents

Lanyue Dou holds a patent for a "Composite heat sink having anisotropic heat transfer metal-graphite composite fins." This invention features a composite server heat sink with a metal base that has a thermal conductivity of at least 200W/mK. The design includes plural fins extending from the metal base, each fin exhibiting anisotropic thermal conductivity ranging from approximately 300 to 650 W/mK in the longitudinal direction and less than approximately 30 W/mK in the widthwise direction. The fins are composed of graphite (approximately 45-70 wt. %), diamond (approximately 2.5 to 10 wt. %), and a metal selected from copper and aluminum. The alignment of graphite along the longitudinal direction of the fin creates the desired anisotropic thermal properties.

Career Highlights

Lanyue Dou is associated with Hfc Industry Limited, where he applies his expertise in thermal management solutions. His innovative approach has positioned him as a key player in the development of advanced heat sink technologies.

Collaborations

Lanyue Dou has collaborated with notable colleagues, including Xiaohua Chen and Chi Ho Kwok. Their combined efforts contribute to the advancement of thermal management solutions in the industry.

Conclusion

Lanyue Dou's innovative work in the field of thermal management, particularly through his patented composite heat sink, showcases his commitment to enhancing the efficiency of electronic devices. His contributions are vital for the ongoing development of effective thermal solutions.

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