Lang Hu

Title: Innovations of Lang Hu in Conductive Region Formation

Introduction

Lang Hu is a notable inventor based in Singapore, SG. He has made significant contributions to the field of conductive materials, particularly through his innovative patent related to copper interconnects. His work is essential in advancing technologies that require efficient and effective conductive regions on substrates.

Latest Patents

Lang Hu holds a patent for a method of forming a conductive region on a first portion of a substrate. This method involves exposing the first portion to a filtered beam of substantially fully ionised metallic ions under a pulsed, modulated electrical bias. The technique utilizes Filtered Cathodic Vacuum Arc (FCVA) methods to generate the filtered ion beam. This innovative approach allows for the formation of a conformal metal coating, even in high aspect ratio vias and trenches. Additionally, it facilitates the in-filling of vias and trenches to create conductive interconnects, with particular emphasis on the deposition of copper ions. An adapted FCVA apparatus is employed to deposit metals on substrates, while a control apparatus manages the ion beams impacting the substrates, making it suitable for integration within existing filtered ion beam sources.

Career Highlights

Lang Hu is currently associated with Nanofilm Technologies International Limited, where he continues to develop and refine his innovative techniques. His work has positioned him as a key figure in the advancement of conductive materials technology.

Collaborations

Lang Hu collaborates with talented individuals such as Li Kang Cheah and Xu Shi, contributing to a dynamic and innovative work environment.

Conclusion

Lang Hu's contributions to the field of conductive materials through his patented methods highlight his role as an influential inventor. His work not only enhances the efficiency of conductive interconnects but also paves the way for future innovations in the industry.