Company Filing History:
Years Active: 2022
Title: Laicun Lin: Innovator in Chip Packaging Technology
Introduction
Laicun Lin is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of chip packaging technology, holding 2 patents that showcase his innovative approach to enhancing electronic devices.
Latest Patents
One of Laicun Lin's latest patents is a chip package device. This device includes a chip, a first substrate, and a second substrate that are positioned opposite each other. The chip is mounted on a surface of the first substrate that faces the second substrate. It is electrically connected to the first substrate through a first conductive part. The first substrate is then connected to the second substrate via a second conductive part. A heat dissipation passage is formed between the chip and the second substrate through a thermally conductive layer. This design allows for efficient heat dissipation, ensuring that the chip maintains a normal operating temperature. Additionally, the device may include a molding compound that wraps the chip for added protection.
Another notable patent is for a package structure with an antenna in package and a communications device. This structure features a substrate with a chip fastened underneath. The antenna includes a first radiator, and the substrate comprises a core layer and a first conductor layer. The first radiator and a first conductive block are positioned on the first conductor layer. The package structure also includes a feed network that connects the chip to the antenna, providing necessary feeding for communication purposes.
Career Highlights
Laicun Lin is currently employed at Huawei Technologies Co., Limited, a leading global provider of information and communications technology (ICT) infrastructure and smart devices. His work at Huawei has allowed him to push the boundaries of chip packaging technology, contributing to the company's innovative product offerings.
Collaborations
Laicun Lin has collaborated with notable colleagues such as Jiajie Tang and Liangsheng Liu. Their combined expertise has fostered advancements in the field of chip packaging and communications technology.
Conclusion
Laicun Lin's contributions to chip packaging technology through his innovative patents have positioned him as a key figure in the electronics industry. His work continues to influence the development of efficient and effective electronic devices.