Location History:
- Daly City, CA (US) (2022)
- San Francisco, CA (US) (2021 - 2023)
Company Filing History:
Years Active: 2021-2023
Title: Innovator Spotlight: Lai Chyan Chow
Introduction: Lai Chyan Chow is a notable inventor based in Daly City, California, who has made significant contributions to the field of packaging and custom embroidery. With a total of six patents to his name, Chow's work exemplifies the intersection of creativity and functionality in modern inventions.
Latest Patents: Among Chow's recent innovations are two groundbreaking patents: "Systems and methods for packaging articles to be embroidered" and the "Direct-to-garment package." The first patent describes a sophisticated packaging solution designed to securely store articles intended for customization via embroidery. This packaging is innovative as it features at least two portions that frame a window, allowing a portion of the article, such as a fabric panel, to be held taut for efficient embroidery. Notably, the packaging can function as a box during the embroidery process and can be transformed into a box afterward, showcasing versatility.
Career Highlights: Chow works with Createme Technologies LLC, a company focused on merging technology with embroidery and packaging solutions. His role there has allowed him to push the boundaries of how articles are customized and presented, making significant advancements in the industry.
Collaborations: At Createme Technologies LLC, Chow collaborates with talented colleagues, including David Bennet Matten and Khamvong Thammasouk. These partnerships reflect a shared vision for innovation in packaging and customization, enhancing the effectiveness of their patented solutions.
Conclusion: Lai Chyan Chow stands out in the inventive landscape with his practical yet innovative approach to packaging for embroidery. His contributions not only streamline processes but also open up new possibilities for customization in the textile industry. With his growing portfolio of patents, Chow's future endeavors are eagerly anticipated by fellow inventors and industry professionals alike.