L William Smith

Title: L William Smith: Innovator in Adhesive Technologies

Introduction

L William Smith is a notable inventor based in San Diego, CA. He has made significant contributions to the field of adhesive technologies, holding a total of 2 patents. His work focuses on creating innovative solutions that enhance the functionality and usability of various articles.

Latest Patents

Among his latest patents is the "Adhesive cover systems for articles." This protective device is designed to attach to and safeguard at least one article. It features a cover with an attachment surface and a display surface opposing the attachment surface. An adhesive coating is applied to the attachment surface to facilitate adhesion to an article. Additionally, a removable backing is releasably attached to the adhesive coating, and at least one relief notch is formed in the cover through the attachment surface, terminating beneath the display surface.

Another significant patent is the "Adhesive printable skin for a portable electronic device." This invention aims to improve the user experience with portable electronic devices by providing a customizable adhesive skin that can be printed on.

Career Highlights

L William Smith is currently associated with Hewlett-Packard Development Company, L.P. His role in the company allows him to leverage his expertise in adhesive technologies to develop innovative products that meet consumer needs.

Collaborations

Throughout his career, L William Smith has collaborated with talented individuals such as Larry E Trigg and James J Genis. These collaborations have contributed to the advancement of his inventions and the successful development of new technologies.

Conclusion

L William Smith's contributions to adhesive technologies demonstrate his innovative spirit and commitment to enhancing product functionality. His patents reflect a deep understanding of user needs and a drive to create practical solutions.