Kwun Yao Ho

Title: Innovations of Kwun Yao Ho

Introduction

Kwun Yao Ho is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of integrated circuit packaging and substrate technology. With a total of 4 patents to his name, his work has had a considerable impact on the electronics industry.

Latest Patents

One of his latest patents is an integrated circuit package with a balanced-part structure. This innovation includes a balanced-part structure that addresses thermal stress conditions of chips connected on a substrate. The design optimizes the amount, locations, weights, and materials of the balanced-part, which is fastened to the substrate to ensure even stress distribution. This approach helps to reduce thermal stress effects and prevent warpage defects in integrated circuit packages.

Another notable patent is related to a lamination process and structure of a high layout density substrate. This process involves forming multiple laminating layers, each containing a dielectric layer, vias, and a patterned conducting layer. The layers are then stacked and laminated simultaneously with a bottom layer to create a multiplayer substrate efficiently.

Career Highlights

Kwun Yao Ho is currently employed at Via Technologies, Inc., where he continues to innovate in the field of electronics. His work has been instrumental in advancing technologies that enhance the performance and reliability of electronic devices.

Collaborations

He has collaborated with notable coworkers, including Moriss Kung and Terry Ku, who have contributed to his projects and innovations.

Conclusion

Kwun Yao Ho's contributions to integrated circuit packaging and substrate technology demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of the challenges in the electronics industry and provide solutions that enhance product performance.