Kwang-soo Kim

Title: Kwang-soo Kim: Innovator in Electronic Device Packaging

Introduction

Kwang-soo Kim is a notable inventor based in Sunnyvale, CA (US). He has made significant contributions to the field of electronic device packaging, holding a total of 3 patents. His innovative designs focus on enhancing the performance and efficiency of electronic devices.

Latest Patents

One of Kwang-soo Kim's latest patents is the "Thermally Enhanced Embedded Die Package." This invention features an electronic device that includes an embedded die frame with a cavity and a routing structure. It incorporates a semiconductor die with a gallium nitride layer and a heat spreader that consists of a thermally conductive insulator layer and a metal plate. The design aims to improve thermal management in electronic devices.

Another significant patent is the "Half Bridge Ceramic Hermetic Package Structure." This electronic device comprises a multilevel ceramic body with multiple plates and semiconductor dies. The structure is designed to optimize space and enhance the performance of the semiconductor components within the ceramic body.

Career Highlights

Kwang-soo Kim is currently employed at Texas Instruments Corporation, where he continues to innovate and develop advanced electronic packaging solutions. His work at Texas Instruments has positioned him as a key player in the industry, contributing to the company's reputation for cutting-edge technology.

Collaborations

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Conclusion

Kwang-soo Kim's contributions to electronic device packaging through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and improve the performance of electronic devices.