Kun Yang

Title: Kun Yang: Innovator in Wireless Power Transfer Technology

Introduction

Kun Yang is a prominent inventor based in Hangzhou, China. He has made significant contributions to the field of wireless power transfer technology. His innovative work has led to the development of a unique inductive coupling system that enhances the efficiency of power transfer in advanced chip packaging.

Latest Patents

Kun Yang holds a patent for an "Inductive coupling system and method for adaptive control of power transfer for wireless three-dimensional stacked chip package." This patent discloses a system that includes a slave chip and a master chip connected via inductive coupling. The system is designed for adaptive control of power transfer, shifting a load feedback voltage received by the slave chip into a feedback voltage data codeword through a level decision circuit. This feedback can then be loaded onto a data link and sent back to the master chip. The master chip features a DPID control circuit that adjusts the frequency of an input clock in the energy transfer system, achieving adaptive control of the transmitting power of the transmitting chip.

Career Highlights

Throughout his career, Kun Yang has worked with notable organizations, including Zhejiang University and Jcet Group Co., Ltd. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking research in wireless technology.

Collaborations

Kun Yang has collaborated with esteemed colleagues such as Xiaolei Zhu and Rushuo Tao. These partnerships have fostered an environment of innovation and have led to advancements in their respective fields.

Conclusion

Kun Yang's contributions to wireless power transfer technology exemplify his dedication to innovation and excellence. His patent and collaborative efforts highlight the importance of adaptive control in modern chip packaging. His work continues to influence the future of technology in significant ways.