Location History:
- Hsinchu, TW (1998)
- Chutung, TW (1998)
Company Filing History:
Years Active: 1998
Title: Innovations of Kun-Tang Teng
Introduction
Kun-Tang Teng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit technology. With a total of 2 patents, his work focuses on enhancing the efficiency and functionality of electronic components.
Latest Patents
One of Kun-Tang Teng's latest patents is an apparatus for placing and aligning solder balls onto solder pads on a multi-chip substrate. This innovative device includes a placement tray and a base seat, designed to facilitate the precise placement of solder balls. The placement tray features a solder ball gate, movement control mechanisms, and alignment cavities, ensuring accurate positioning of solder balls during assembly.
Another significant patent involves an integrated circuit package that provides multiple heat-conducting paths. This invention includes an IC chip securely attached to an adapter board, covered by a chip cap made of thermal conductive materials. The design enhances heat dissipation through a heat sink and a ball grid array (BGA), improving the overall performance of the integrated circuit.
Career Highlights
Kun-Tang Teng is associated with the Industrial Technology Research Institute, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of integrated circuits, making them more efficient and reliable.
Collaborations
He has collaborated with notable colleagues such as Shin-Tang Jian and Shu-Chen Huang, contributing to various projects that push the boundaries of technology.
Conclusion
Kun-Tang Teng's contributions to the field of integrated circuits through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of advanced electronic components.