Company Filing History:
Years Active: 2004
Title: Innovations of Kun-joong Park
Introduction
Kun-joong Park is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of substrate etching, particularly through his innovative methods that enhance the efficiency of plasma dry etching processes. His work is characterized by a focus on simplifying complex procedures while maintaining the regular flow of ions.
Latest Patents
Kun-joong Park holds a patent for a "Method of through-etching substrate." This method simplifies the process of through-etching a substrate, ensuring that the flow of ions remains consistent during the plasma dry etching process. The technique involves forming a buffer layer on the first plane of the substrate, followed by a metal layer on the buffer layer. An etching mask pattern is then created on the second plane, which is opposite to the first plane. The substrate is subsequently through-etched using this etching mask pattern. The substrate is preferably made of single-crystal silicon, the buffer layer is composed of silicon dioxide, and the metal layer is formed of aluminum.
Career Highlights
Throughout his career, Kun-joong Park has demonstrated a commitment to advancing etching technologies. His innovative methods have been recognized for their potential to improve manufacturing processes in various industries. His patent reflects his expertise and dedication to research and development in the field.
Collaborations
Kun-joong Park has collaborated with notable colleagues, including Seung-jin Song and Kyoungdoug Min. These partnerships have contributed to the advancement of their collective research efforts and innovations in substrate etching.
Conclusion
Kun-joong Park is a distinguished inventor whose work in substrate etching has led to significant advancements in the field. His patented method showcases his innovative approach to simplifying complex processes while ensuring efficiency. His contributions continue to influence the industry and inspire future innovations.