Kun-Chi Chen

Title: Kun-Chi Chen: Innovator in Multilayer Printed Circuit Board Technology

Introduction

Kun-Chi Chen is a notable inventor based in Bangiao, Taiwan. He has made significant contributions to the field of printed circuit board technology. His innovative approach has led to the development of a unique method for manufacturing multilayer printed circuit boards with built-in electronic devices.

Latest Patents

Kun-Chi Chen holds a patent for a method of manufacturing a multilayer printed circuit board with a built-in electronic device. This method involves providing a substrate that includes a copper clad laminate and a first dielectric layer. The first dielectric layer is laminated onto the copper clad laminate and features a cavity designed to accommodate the electronic device. A second dielectric layer is then laminated onto the substrate and electronic device, resulting in a base circuit board with an embedded electronic device. Finally, a build-up circuit layer is formed on the base circuit board, with both dielectric layers made from a plastic material.

Career Highlights

Kun-Chi Chen is currently employed at Unitech Printed Circuit Board Corporation, where he continues to advance the technology in his field. His work has been instrumental in enhancing the efficiency and functionality of printed circuit boards.

Collaborations

Throughout his career, Kun-Chi Chen has collaborated with talented individuals such as Cheng-Hsien Chou and Shun-Yueh Hsu. These collaborations have contributed to the successful development of innovative technologies in the printed circuit board industry.

Conclusion

Kun-Chi Chen's contributions to the field of printed circuit board technology exemplify his dedication to innovation. His patented method for manufacturing multilayer printed circuit boards with embedded electronic devices showcases his expertise and commitment to advancing technology.