Akron, OH, United States of America

Kun Chen


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Kun Chen: Innovator in Electrically Conductive Polymer Adhesives

Introduction

Kun Chen is a notable inventor based in Akron, OH (US). He has made significant contributions to the field of electrically conductive polymer compositions. His innovative work focuses on enhancing the properties of polymer adhesives through the incorporation of advanced materials.

Latest Patents

Kun Chen holds a patent for "Electrically conductive polymer adhesives with complex dimensional filters." This invention involves a polymer composition that includes a conductive metal filler material and carbon-based filler materials. The unique aspect of this invention is that the aspect ratio of the carbon-based filler material is at least ten times greater than that of the conductive metal filler material. The carbon-based materials may include carbon nanotubes, multi-walled carbon nanotubes, and edge-functionalized graphene.

Career Highlights

Kun Chen is affiliated with the University of Akron, where he continues to advance research in polymer science and engineering. His work has implications for various applications, including electronics and materials science.

Collaborations

Some of his notable coworkers include Yu Zhu and Bryan D Vogt, who contribute to the collaborative research environment at the University of Akron.

Conclusion

Kun Chen's innovative work in electrically conductive polymer adhesives showcases his expertise and commitment to advancing material science. His contributions are paving the way for new applications and technologies in the field.

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