Kuan Pei Yap

Title: Kuan Pei Yap: Innovator in Semiconductor Technology

Introduction

Kuan Pei Yap is a notable inventor in the field of semiconductor technology, based in Selangor, Malaysia. He has made significant contributions to the industry, particularly in the area of copper interconnects. With a total of two patents to his name, his work has had a lasting impact on semiconductor device fabrication.

Latest Patents

Kuan Pei Yap's latest patents focus on the passivation of copper interconnect surfaces with a passivating metal layer. The process involves forming an interconnect line on an intermetal dielectric (IMD) layer within a semiconductor device. This includes creating a diffusion barrier on the walls and bottom of the interconnect hole, filling it with a copper metal line, and performing a chemical mechanical polishing (CMP) step to planarize the device. A passivating metal layer is then deposited on the surface of the copper metal line, encapsulating it at the top of the hole. This innovative approach enhances the reliability and performance of semiconductor devices.

Career Highlights

Throughout his career, Kuan Pei Yap has worked with prominent organizations such as Chartered Semiconductor Manufacturing Ltd. and the National University of Singapore. His experience in these institutions has allowed him to develop and refine his expertise in semiconductor technology.

Collaborations

Kuan Pei Yap has collaborated with notable colleagues, including Lap Chan and Kheng Chok Tee. These partnerships have contributed to the advancement of his research and innovations in the field.

Conclusion

Kuan Pei Yap's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to shape the future of semiconductor device fabrication.