Company Filing History:
Years Active: 2025
Title: Kuan-I Lee: Innovator in Thermal Insulation Technology
Introduction
Kuan-I Lee is a notable inventor based in Tsukuba, Japan. He has made significant contributions to the field of thermal insulation technology. His innovative approach has led to the development of a unique thermal insulation pipe that addresses both cost and performance.
Latest Patents
Kuan-I Lee holds 1 patent for his invention of a thermal insulation pipe. The objective of this invention is to provide a pipe through which fluids can flow, achieving thermal insulation in the space between an inner wall and an outer wall at low cost and high performance. The thermal insulation pipe is designed as a double wall pipe consisting of an inner pipe and an outer pipe. The thermal-insulating material used is an aerogel with a three-dimensional network structure, which is formed by a cluster of aggregated primary particles. This innovative material includes fine particles that enhance thermal insulation efficiency. A preferred form of this material is weakly bonded aerogel ultrafine particles, which are generated by crushing low-binding ultrafine aerogel at ultra-high speed under specific manufacturing conditions.
Career Highlights
Kuan-I Lee has worked with esteemed organizations such as the National Institute for Materials Science and Krosakiharima Corporation. His experience in these institutions has allowed him to refine his expertise in materials science and thermal insulation technologies.
Collaborations
Throughout his career, Kuan-I Lee has collaborated with notable colleagues, including Rudder Wu and Kazuhiro Matsuzaki. These partnerships have contributed to the advancement of his research and innovations.
Conclusion
Kuan-I Lee's contributions to thermal insulation technology exemplify the impact of innovative thinking in engineering. His patented thermal insulation pipe represents a significant advancement in the field, showcasing his dedication to improving performance and cost-effectiveness in fluid transport systems.