Company Filing History:
Years Active: 1997-1998
Title: Kousuke Azuma: Innovator in Semiconductor Molding Technology
Introduction
Kousuke Azuma is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the area of molding processes. With a total of 2 patents to his name, Azuma's work focuses on improving the efficiency and quality of semiconductor packaging.
Latest Patents
Azuma's latest patents include a resin sealing mold die set designed to minimize resin remainder for semiconductor applications. This innovative mold die set is composed of an upper and lower mold die, which work together to create a package body that includes a lead frame and a semiconductor chip. The design features a runner section and a table section that enhance the molding process by ensuring that the lead frame's hole is optimally positioned.
Another notable patent is a molding die for sealing semiconductor devices that reduces resin burrs. This invention incorporates an upper and lower mold half, with a lead frame sandwiched in between. The design ensures that the final product is free from resin burrs, thereby improving the overall quality of the semiconductor element.
Career Highlights
Kousuke Azuma is currently employed at NEC Corporation, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the efficiency of molding processes, which are critical in the production of semiconductor devices.
Collaborations
Azuma collaborates with talented colleagues, including Atsuhiko Izumi and Takehito Inaba. Their combined expertise contributes to the development of cutting-edge technologies in the semiconductor industry.
Conclusion
Kousuke Azuma's contributions to semiconductor molding technology are noteworthy, as evidenced by his patents and ongoing work at NEC Corporation. His innovations play a crucial role in enhancing the efficiency and quality of semiconductor packaging processes.