Tokyo, Japan

Kosuke Yamada

USPTO Granted Patents = 1 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):

Title: **Kosuke Yamada: Innovator in Bonding Methodologies**

Introduction

Kosuke Yamada, a prominent inventor based in Tokyo, Japan, has made significant contributions to the field of bonding technologies. With a focus on high-temperature applications, his innovative approach has the potential to revolutionize various industries by enhancing connection reliability and strength.

Latest Patents

Yamada holds a noteworthy patent titled "Bonding Method and Structure." This invention introduces a bonding method that achieves high bonding strength and reliable connections in high-temperature areas through a straightforward low-temperature bonding process. The method consists of three critical steps: First, a thin film of noble metal is deposited on the smooth surfaces of the materials to be bonded using atomic layer deposition at a vacuum of 1.0 Pa or higher. Second, a laminate is created by overlapping the two materials, connecting them through the thin film. Finally, the bonded materials are fused at a predetermined temperature, ensuring robust connections even under challenging conditions.

Career Highlights

Throughout his career, Kosuke Yamada has worked with esteemed organizations, including Waseda University and Harima Chemicals, Incorporated. His professional journey reflects a commitment to research and innovation, emphasizing the practical applications of his findings in real-world scenarios.

Collaborations

Yamada has collaborated with several notable professionals in his field, including Jun Mizuno and Hiroyuki Kuwae. These partnerships have enriched the development of his bonding methods and facilitated the exchange of ideas, further advancing the technology.

Conclusion

Kosuke Yamada's contributions to bonding methodologies illustrate the importance of innovation in enhancing connection reliability and strength in various applications. His patent is a testament to the potential that exists in the field of bonding technologies, promising improved performance in high-temperature environments. As he continues to collaborate and innovate, the impact of his work will likely resonate across multiple industries.

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