Company Filing History:
Years Active: 2016-2019
Title: Innovations by Kosuke Inoue in Solder Technology
Introduction
Kosuke Inoue is a notable inventor based in Hyogo, Japan, recognized for his contributions to solder technology. With a total of five patents to his name, Inoue has made significant advancements in the field, particularly in the development of solder alloys and solder pastes.
Latest Patents
Inoue's latest patents include innovations in solder alloy, solder paste, and electronic circuit boards. His solder alloy consists of a unique combination of tin, silver, copper, bismuth, antimony, and cobalt. The silver content ranges from 3 mass % to 3.5 mass %, while the copper content is between 0.4 mass % and 1.0 mass %. Additionally, the bismuth content is specified to be between 3.5 mass % and 4.8 mass %, and the antimony content ranges from 3 mass % to 5.5 mass %. The cobalt content is carefully controlled between 0.001 mass % and 0.1 mass %, with tin making up the balance. Furthermore, Inoue's soldering flux features an acrylic resin base, which includes two types of acrylic resins with distinct acid values, enhancing the performance of solder paste.
Career Highlights
Kosuke Inoue is currently employed at Harima Chemicals, Incorporated, where he continues to innovate in the field of solder technology. His work has been instrumental in improving the quality and efficiency of solder materials used in electronic applications.
Collaborations
Inoue collaborates with talented coworkers, including Kazuya Ichikawa and Tadashi Takemoto, who contribute to the research and development efforts at Harima Chemicals.
Conclusion
Kosuke Inoue's contributions to solder technology through his innovative patents have significantly impacted the industry. His work exemplifies the importance of research and development in advancing materials used in electronics.