Tokyo, Japan

Koki Akutsu

USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.9

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022

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2 patents (USPTO):Explore Patents

Title: Innovations of Koki Akutsu: Advancements in Blister Packaging

Introduction

Koki Akutsu, a noted inventor based in Tokyo, Japan, has made significant contributions to the field of packaging through his innovative designs. With two patents to his name, Akutsu's work focuses on enhancing the functionality and durability of blister packaging, ensuring products remain secure and uncontaminated.

Latest Patents

Among his latest patents, the first is a PTP blister sheet designed to exhibit a high adsorption effect over prolonged periods. This sheet features a gas barrier layer combined with an odor adsorption layer, which is composed of a heat-sealable resin that includes an odor adsorption agent. This agent, supported by an inorganic porous body, works to keep contents fresh and uncontaminated. The second patent is related to a PTP blister pack formed from the same materials. It details a bag designed to reduce damage, such as the formation of holes and wrinkles, by incorporating laminated bodies that include a sealant film on the inner surface. The design of the bag ensures that a steam-releasing seal part peels off at an internal pressure of 130 kPa or lower, enhancing the bag's functionality.

Career Highlights

Koki Akutsu is associated with Dai Nippon Printing Co., Ltd., a company renowned for its innovative printing and packaging solutions. His role in this company has allowed him to explore new technologies and develop patents that meet modern packaging demands. His creative contributions demonstrate both technical expertise and an understanding of market needs.

Collaborations

Throughout his career, Akutsu has collaborated with notable colleagues, including Naoya Takeuchi and Taeko Matsushita. These partnerships have fostered an environment of creativity and research, allowing for the exchange of ideas and improvement of packaging technologies.

Conclusion

Koki Akutsu's innovations in blister packaging, particularly through his recent patents, reflect a commitment to improving product safety and longevity. His work at Dai Nippon Printing Co., Ltd. and collaborations with fellow inventors are instrumental in driving advancements in the packaging industry. The focus on high-performance materials and practical designs ensures his contributions will have an enduring impact on market practices.

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