Koji Yamada

Title: Koji Yamada: Innovator in Foam Bonding Technology

Introduction

Koji Yamada is a notable inventor based in Ayase, Japan. He has made significant contributions to the field of manufacturing, particularly in methods for bonding foam materials to cover materials. With a total of 2 patents, Yamada's work showcases innovative techniques that enhance product durability and manufacturing efficiency.

Latest Patents

Yamada's latest patents include a "Method and apparatus for integrally attaching a cover material to a foam seat pad." This method involves positioning a two-ply cover material in a set stand of a lower mold, ensuring precise alignment while a retaining member maintains this alignment. The process includes the introduction of foam resin into the defined space, followed by pressurization to set the foam resin effectively. Another patent, titled "Method of manufacturing article including integrated cover material," describes a technique where a heat-activated adhesive is applied to a foam pad. The pad is then affixed to a mounting member, and after heating, the upper and lower mounting members are pressed together to ensure strong bonding.

Career Highlights

Koji Yamada is associated with Ikeda Bussan Co. Ltd., where he has been instrumental in developing innovative manufacturing processes. His expertise in foam bonding technology has positioned him as a key figure in the industry.

Collaborations

Yamada has worked alongside talented colleagues such as Masanobu Kikuchi and Norio Yanagishita. Their collaborative efforts have contributed to advancements in manufacturing techniques and product development.

Conclusion

Koji Yamada's contributions to foam bonding technology reflect his dedication to innovation in manufacturing. His patents demonstrate a commitment to improving product quality and efficiency in the industry.