Osaka, Japan

Kohji Ohnuki


Average Co-Inventor Count = 3.8

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Amagasaki, JP (1996)
  • Osaka, JP (2014 - 2018)

Company Filing History:


Years Active: 1996-2018

Loading Chart...
3 patents (USPTO):Explore Patents

Title: Kohji Ohnuki: Innovator in Semiconducting Technology

Introduction

Kohji Ohnuki is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of semiconducting technology, holding a total of 3 patents. His work focuses on developing advanced materials for electrographic devices and semiconductive rubber products.

Latest Patents

Ohnuki's latest patents include a semiconducting component for an electrographic device. This invention comprises a crosslinked body obtained by crosslinking a copolymer containing specific structural units. Another significant patent is for a composition for semiconductive rubber, which includes an epichlorohydrin-based rubber and various crosslinking agents. These innovations demonstrate his expertise in creating materials that enhance the performance of electronic devices.

Career Highlights

Throughout his career, Ohnuki has worked with prominent companies such as Daiso Co., Ltd. and Osaka Soda Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various projects in the field of semiconducting technology.

Collaborations

Ohnuki has collaborated with notable coworkers, including Yoritaka Yasuda and Yoshihiro Tomoshige. These partnerships have fostered a creative environment that has led to innovative solutions in their respective fields.

Conclusion

Kohji Ohnuki is a distinguished inventor whose work in semiconducting technology has made a lasting impact. His patents and collaborations reflect his commitment to advancing the industry and improving electronic materials.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…