Company Filing History:
Years Active: 2025
Title: Kohei Hirayama: Innovator in Photocurable Adhesives
Introduction
Kohei Hirayama is a notable inventor based in Kuki, Japan. He has made significant contributions to the field of photocurable adhesives, holding a total of 2 patents. His work focuses on developing innovative adhesive solutions that enhance performance and reduce environmental impact.
Latest Patents
Hirayama's latest patents include advancements in photocurable adhesives. The first patent describes a photocurable adhesive that exhibits excellent deep-section curability. This adhesive is formulated to be curable through laser light irradiation and contains an epoxy adhesive component along with titanium black. The titanium black is present in a mass range of 1 ppm to 150 ppm relative to 100 parts by mass of the epoxy adhesive component, with a primary particle size between 5 nm and 150 nm. The second patent presents a photocurable adhesive designed to minimize gas emissions from the cured product. This formulation also utilizes laser light irradiation for curing and includes an epoxy adhesive component, a light-absorbing component for heat generation, a cyanate ester resin, an epoxy resin, a latent amine curing agent, and an ion scavenger.
Career Highlights
Throughout his career, Kohei Hirayama has worked with prominent companies such as Denso Corporation and Adeka Corporation. His experience in these organizations has allowed him to refine his expertise in adhesive technologies and contribute to various innovative projects.
Collaborations
Hirayama has collaborated with talented individuals in his field, including Kazuma Yamaguchi and Keisuke Ota. These partnerships have fostered a creative environment that encourages the development of cutting-edge adhesive solutions.
Conclusion
Kohei Hirayama's contributions to the field of photocurable adhesives demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of material science and a dedication to improving adhesive technologies.