Koei Maruyama

Title: Koei Maruyama: Innovator in Semiconductor Technology

Introduction

Koei Maruyama is a notable inventor based in Niigata, Japan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor device and its manufacturing method.

Latest Patents

Maruyama holds a patent for a semiconductor device and method of manufacturing the same. This invention involves bonding a semiconductor chip onto a die pad portion of a lead frame that includes nickel/palladium/gold stacked plate layers. The first bonding procedure utilizes a metal wire of gold pressed against an electrode pad of the semiconductor chip while applying a load of approximately 60 g and ultrasonic waves with a power of approximately 55 mW. The second bonding procedure involves pressing the metal wire against an inner lead portion of the lead frame while applying a load of 150 through 250 g and ultrasonic waves with a power of 0 through 20 mW. This method allows for firm bonding in a short period without causing peeling of the gold plate layer.

Career Highlights

Koei Maruyama is associated with Matsushita Electronics Corporation, where he has been able to apply his expertise in semiconductor technology. His work has been instrumental in advancing the company's capabilities in this field.

Collaborations

Maruyama has collaborated with notable colleagues such as Sadayoshi Arakawa and Seiichi Ito. Their combined efforts have contributed to the success of various projects within the semiconductor industry.

Conclusion

Koei Maruyama's contributions to semiconductor technology exemplify the innovative spirit of modern inventors. His patent and work at Matsushita Electronics Corporation highlight the importance of advancements in this critical field.