Ibaraki-ken, Japan

Kiyoshi Hirosawa


Average Co-Inventor Count = 10.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Kiyoshi Hirosawa: Innovator in Bonding Film Technology

Introduction

Kiyoshi Hirosawa is a notable inventor based in Ibaraki-ken, Japan. He has made significant contributions to the field of materials science, particularly in the development of bonding films for printed circuit boards. His innovative approach has led to advancements that enhance the durability and functionality of electronic components.

Latest Patents

Kiyoshi Hirosawa holds a patent for a bonding film designed specifically for printed circuit boards. This bonding film is resistant to cracking, even when subjected to bending with a small radius of curvature. It possesses sufficient mechanical strength in its semi-cured state, facilitating easier handling. The film is not undesirably brittle, which prevents the production of unwanted debris during cutting. Additionally, it is flexible and flame retardant. The bonding film may consist of high polymer epoxy resin, denatured polyamide obtained by reacting epoxy resin and polyamide, polyfunctional epoxy resin, and a curing agent. The denatured polyamide preferably includes a polyalkylene-glycol residue or a polycarbonate-diol residue. The high polymer epoxy resin is produced through the polymerization of bifunctional epoxy resin and bifunctional phenol resin, with a weight averaged molecular weight of 50,000 or higher.

Career Highlights

Kiyoshi Hirosawa is associated with Hitachi Chemical Company, Ltd., where he has been instrumental in advancing bonding film technology. His work has significantly impacted the manufacturing processes of printed circuit boards, contributing to the reliability and performance of electronic devices.

Collaborations

Kiyoshi has collaborated with notable colleagues, including Atsushi Takahashi and Shinji Ogi. Their combined expertise has fostered innovation and development in the field of materials science.

Conclusion

Kiyoshi Hirosawa's contributions to bonding film technology exemplify the importance of innovation in the electronics industry. His patented advancements continue to influence the design and manufacturing of printed circuit boards, ensuring enhanced performance and reliability.

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