Kiminori Washika

Title: Kiminori Washika: Innovator in Metal and Resin Bonding Technologies

Introduction

Kiminori Washika is a notable inventor based in Hiroshima, Japan. He has made significant contributions to the field of bonding technologies, particularly in the integration of thermoplastic resins with metal materials. With a total of two patents to his name, Washika's work showcases innovative methods that enhance the efficiency and effectiveness of bonding processes.

Latest Patents

Washika's latest patents include a method of bonding thermoplastic resin and metal. This method involves a three-step process that begins with irradiating the metal surface with a pulse laser under an oxidizing atmosphere to create a surface modification region. The second step requires the thermoplastic resin to abut against this modified surface to form a bonding interface. Finally, the interface is heated by laser irradiation to achieve a strong bond. His other patent, a method for bonding metal and resin, outlines a direct bonding technique that utilizes electrolytic treatment with carboxylic acid to prepare the metal surface, followed by a series of heating and cooling steps to ensure a robust bond.

Career Highlights

Throughout his career, Kiminori Washika has worked with prominent organizations such as Hirotec Corporation and Osaka University. His experience in these institutions has allowed him to refine his expertise in material bonding and develop innovative solutions that address industry challenges.

Collaborations

Washika has collaborated with notable colleagues, including Tatsumi Kawafuchi and Yousuke Kawahito. These partnerships have contributed to the advancement of his research and the successful implementation of his patented technologies.

Conclusion

Kiminori Washika stands out as an influential inventor in the field of bonding technologies. His innovative methods for integrating metal and resin materials have the potential to revolutionize various applications in manufacturing and engineering.