Company Filing History:
Years Active: 1995-2011
Title: Kimiji Nishimaki: Innovator in Semiconductor Bonding Technology
Introduction
Kimiji Nishimaki is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, particularly in wire bonding methods. With a total of 6 patents to his name, Nishimaki's work has advanced the efficiency and accuracy of semiconductor manufacturing processes.
Latest Patents
Nishimaki's latest patents include innovative methods for inspecting and measuring the bonded status of wire balls in semiconductor applications. One notable patent is an inspection method that determines the bonded status of a wire ball bonded to a pad of a semiconductor chip. This method utilizes an image-taking unit to capture images of the bonding position, allowing for the detection of various parameters such as the in-focus height of the pad and the bonded ball. The method employs different colors of coaxial illuminating light to enhance the inspection process, using blue light for detecting the pad and external diameter of the bonded ball, while red or yellow light is used for the upper surface of the bonded ball.
Another significant patent involves a method for measuring the thickness of a bonded ball in wire bonding. This method includes taking images of the pad and ball at various vertical positions and analyzing luminance variations to determine the in-focus heights. By calculating the difference between these heights, the thickness of the bonded ball can be accurately measured.
Career Highlights
Kimiji Nishimaki is currently associated with Kaijo Corporation, where he continues to innovate in the field of semiconductor technology. His expertise and dedication have made him a valuable asset to the company and the industry as a whole.
Collaborations
Throughout his career, Nishimaki has collaborated with notable colleagues such as Takashi Kamiharako and Noritaka Horiuchi. These collaborations have further enriched his work and contributed to advancements in semiconductor bonding techniques.
Conclusion
Kimiji Nishimaki's contributions to semiconductor technology through his innovative patents and collaborative efforts have significantly impacted the industry. His work continues to pave the way for advancements in wire bonding methods, enhancing the efficiency and reliability of semiconductor manufacturing processes.