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Years Active: 2021
Title: Kiichiro Mori: Innovator in Power Module Substrates
Introduction
Kiichiro Mori is a notable inventor based in Yamaguchi, Japan. He has made significant contributions to the field of power module substrates, particularly in enhancing the efficiency and reliability of semiconductor devices. His innovative approach addresses critical issues related to heat dissipation and structural integrity in power modules.
Latest Patents
Mori holds a patent for a substrate for power modules, which includes a collective substrate for power modules and a method for manufacturing the substrate. This invention allows for prompt heat dissipation from a semiconductor device, effectively preventing the separation of a ceramic plate and a copper plate at their joint interface, as well as cracks in the ceramic plate. The design features a ceramic plate with a copper circuit plate on one surface and a heat dissipation copper plate on the opposite surface. The copper circuit plate consists of at least one first copper circuit plate and at least one second copper circuit plate, with the first copper circuit plate designed to mount the semiconductor device.
Career Highlights
Throughout his career, Kiichiro Mori has worked with prominent companies such as NGK Electronics Devices, Inc. and NGK Insulators, Inc. His experience in these organizations has contributed to his expertise in the development of advanced materials and technologies for power modules.
Collaborations
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Conclusion
Kiichiro Mori's innovative work in power module substrates exemplifies the importance of addressing thermal management and structural challenges in semiconductor technology. His contributions continue to influence the field and pave the way for future advancements.