Inch'on, South Korea

Ki Tae Ryu


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 162(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Ki Tae Ryu: Innovator in Integrated Circuit Packaging

Introduction: Ki Tae Ryu, an accomplished inventor based in Inch'on, South Korea, has significantly contributed to the field of integrated circuit technology. With a focus on improving heat dissipation and minimizing weight in electronic devices, his innovative mind has led to the development of a notable patent that enhances the performance of packaged integrated circuits.

Latest Patents: Ki Tae Ryu holds a patent for a ball grid array package. This innovative packaged integrated circuit device showcases impressive heat dissipation performance while maintaining a lightweight design. The invention incorporates an interconnection substrate with conductive trace and insulating material layers, along with a unique arrangement of electrical contacts and a metal thermal conductive layer. This design allows for effective thermal management while securely housing an integrated circuit chip within a specially formed through hole region, thereby elevating the standard for future electronic components.

Career Highlights: Ki Tae Ryu is associated with Hyundai Electronics Industries Co., Ltd., where he utilizes his expertise to push the boundaries of electronic packaging technologies. His work is instrumental in the ongoing pursuit of efficiencies in integrated circuit design, aligning with the company's mission to deliver cutting-edge electronic solutions.

Collaborations: Throughout his career, Ki Tae Ryu has collaborated with talented colleagues such as Tae Sung Jeong and Tae Keun Lee. Their combined efforts foster a creative environment that nurtures innovation within Hyundai Electronics, where they strive to develop advancements in integrated circuit technology.

Conclusion: Ki Tae Ryu stands out as a key player in the realm of integrated circuit packaging innovation. His patented ball grid array package signifies a leap forward in heat dissipation and lightweight design, setting a benchmark for future developments. With his ongoing contributions at Hyundai Electronics Industries Co., Ltd. and his collaborations with fellow innovators, Ki Tae Ryu continues to shape the future of electronic technology.

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