Company Filing History:
Years Active: 2020-2021
Title: Ki Cheol Bae: Innovator in Semiconductor Technology
Introduction
Ki Cheol Bae is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative assembly structures that enhance the performance and efficiency of electronic devices.
Latest Patents
One of Ki Cheol Bae's latest patents is a semiconductor assembly with a package on package (POP) structure. This invention includes a first semiconductor package that features a first lower substrate, a first upper substrate facing the first lower substrate, and a first semiconductor chip mounted on the first lower substrate. The POP structure also incorporates a second semiconductor package with a second lower substrate stacked on the first semiconductor package, which is spaced apart from it. Additionally, a second semiconductor chip is mounted on the second lower substrate. At least one passive element is integrated into either the first upper substrate or the second lower substrate, ensuring electrical connectivity to the second semiconductor chip.
Career Highlights
Ki Cheol Bae is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His role involves developing advanced semiconductor solutions that are crucial for modern electronic devices. His expertise in semiconductor assembly has positioned him as a key player in the industry.
Collaborations
Throughout his career, Ki Cheol Bae has collaborated with notable colleagues, including Kwang Sub Lee and Sang Gyun Lee. These partnerships have fostered innovation and contributed to the successful development of cutting-edge technologies.
Conclusion
Ki Cheol Bae's contributions to semiconductor technology exemplify his commitment to innovation and excellence. His patents reflect a deep understanding of electronic device architecture, making him a valuable asset in the field.