Company Filing History:
Years Active: 2009
Title: Kevin Beattie: Innovator in Chip Package Simulation
Introduction: Kevin Beattie, a legal representative based in Muenchberg, DE, is recognized for his innovative contribution to the field of chip package simulation. With a focused approach towards enhancing the design and functionality of chip packages, his single patent highlights his expertise and dedication in this technical domain.
Latest Patents: Kevin Beattie holds a notable patent titled "Compact Chip Package Macromodels for Chip-Package Simulation." This invention presents a computer-implemented method, a data processing system, and computer-usable program code aimed at reducing a chip package model. The innovation involves measuring the inductance and resistance of the chip package model using a set of external nodes. Consequently, a reduced node resistor model and a reduced node inductor model are created by combining the measured values, leading to a compact chip package model that optimizes simulation processes.
Career Highlights: Currently working with International Business Machines Corporation (IBM), Kevin Beattie's career is marked by his dedication to advancing technology in semiconductor design. His ability to merge legal expertise with engineering principles allows him to navigate the complexities of patent law effectively.
Collaborations: Kevin has collaborated with talented coworkers, including Michael Werner Beattie and Byron Lee Krauter. Their collective efforts reflect a synergy that drives innovation and productivity within the team.
Conclusion: Kevin Beattie stands out as an inventor committed to improving chip package simulation through his groundbreaking patent. His work at IBM and collaborations with esteemed colleagues underscore the significance of innovation in the tech industry. As technological demands continue to evolve, Kevin's contributions will likely play an essential role in shaping future advancements.