Company Filing History:
Years Active: 2002
Title: Kenzo Hirano: Innovator in Printed Circuit Board Technology
Introduction
Kenzo Hirano is a notable inventor based in Nagoya, Japan. He has made significant contributions to the field of printed circuit board technology. His innovative approach has led to the development of a unique method for interconnecting printed circuit boards.
Latest Patents
Hirano holds a patent for a "Method for interconnecting printed circuit boards and interconnection structure." This patent describes a process that involves preparing a first and second printed circuit board, where the first board has an insulating substrate made of thermoplastic resin and a conductive pattern with a land. The second board also features a conductive pattern with a land. The method includes overlapping the lands of both boards to form an interconnection portion. This portion is then heated above the glass transition temperature of the thermoplastic resin while pressure is applied, creating an electrical interconnection sealed with part of the thermoplastic resin. Additionally, the insulating substrate of the first board is overlapped with that of the second board, interposing a film that reduces the modulus of elasticity of the first board's insulating substrate.
Career Highlights
Kenzo Hirano is currently employed at Denso Corporation, a leading company in the automotive industry. His work focuses on enhancing the efficiency and reliability of electronic components through innovative interconnection methods. Hirano's contributions have been instrumental in advancing the technology used in modern vehicles.
Collaborations
Hirano has collaborated with notable colleagues such as Toshihiro Miyake and Katsuaki Kojima. Their combined expertise has fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Kenzo Hirano's work in printed circuit board technology exemplifies the spirit of innovation. His patented methods are paving the way for advancements in electronic interconnections, showcasing the importance of creativity in engineering.