Company Filing History:
Years Active: 2001-2002
Title: Innovations of Kenneth Robert Herman
Introduction
Kenneth Robert Herman is a notable inventor based in Poughkeepsie, NY (US). He has made significant contributions to the field of solder interconnections, particularly in low-temperature chip attachment methods. With a total of 2 patents, his work has had a considerable impact on the electronics industry.
Latest Patents
One of Kenneth's latest patents is a method for forming a reflowed solder ball with a low melting point metal cap. This innovative method and structure utilize solder balls for making low-temperature chip attachments directly to higher levels of packaging substrates. After forming a solder ball using standard methods, it is reflowed to achieve a smooth surface. A layer of low melting point metal, such as bismuth, indium, or preferably pure tin, is deposited on top of the solder balls. This structure localizes the eutectic alloy formed during subsequent low-temperature joining cycles to the top of the high melting solder ball, even after multiple low-temperature reflow cycles. This method eliminates the need for tinning the substrate to which the chip is joined, making it an economical solution. Additionally, when the temperature is raised slightly above the eutectic temperature, a liquid fillet forms around the joint with copper wires. This liquid fillet formation significantly improves thermal fatigue life by reducing stress at the interface and provides an easy means for chip removal for burn-in, replacement, or field repairs.
Career Highlights
Kenneth Robert Herman is associated with the International Business Machines Corporation (IBM), where he has contributed to various innovative projects. His expertise in solder interconnections has positioned him as a valuable asset in the field of electronics.
Collaborations
Some of Kenneth's notable coworkers include Hormazdyar M Dalal and Alexis Bitaillou. Their collaborative efforts have further advanced the research and development of solder technologies.
Conclusion
Kenneth Robert Herman's contributions to the field of solder interconnections demonstrate his innovative spirit and dedication to improving electronic manufacturing processes. His patents reflect a commitment to enhancing the efficiency and reliability of chip attachments in the industry.