Company Filing History:
Years Active: 1992-1993
Title: The Innovations of Kenneth Cholewczynski
Introduction
Kenneth Cholewczynski is a notable inventor based in Streamwood, IL (US). He has made significant contributions to the field of integrated circuit technology, holding a total of 3 patents. His work primarily focuses on methods for forming solder bump interconnections, which are crucial for the assembly of electronic components.
Latest Patents
Cholewczynski's latest patents include innovative methods for forming solder bump interconnections. One of his patents describes a low-temperature method for attaching an integrated circuit component to a printed circuit board. This method involves using metal bumps formed of an indium-base alloy, which are connected to a metal-plated terminal on the board made of a tin-base alloy. The assembly is heated to a temperature below the melting points of both metals, allowing them to form a liquid phase that solidifies upon cooling, thus completing the interconnection.
Another patent outlines a method for attaching an integrated circuit component to a printed circuit board using solder bump interconnections with a solder-plated circuit trace. This method utilizes a solder plate made of a first solder alloy, which is fused to the bumps of a second solder alloy with a higher melting temperature. The process ensures a reliable connection between the component and the board.
Career Highlights
Kenneth Cholewczynski has had a distinguished career at Motorola Corporation, where he has been instrumental in advancing soldering techniques for electronic components. His innovative approaches have contributed to the efficiency and reliability of electronic assemblies.
Collaborations
Throughout his career, Cholewczynski has collaborated with talented individuals such as Kevin Douglas Moore and Cynthia M Melton. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in the field.
Conclusion
Kenneth Cholewczynski's contributions to the field of integrated circuit technology through his patents and work at Motorola Corporation highlight his role as a significant inventor. His innovative methods for forming solder bump interconnections continue to impact the electronics industry positively.