Company Filing History:
Years Active: 2019-2020
Title: Kenji Tokuda: Innovator in Packing Technology
Introduction
Kenji Tokuda is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of packing technology, holding a total of 2 patents. His innovative designs focus on enhancing the efficiency of gas-liquid contact systems.
Latest Patents
One of Kenji Tokuda's latest patents involves a unique packing structure. This packing consists of multiple sheet materials that are arranged in parallel, allowing liquid to flow along their flat surfaces in a standing use state. Each sheet material is supported by a group of support members, which are strategically arranged to ensure optimal performance. The design includes support walls that are parallel to the liquid flow direction, creating a sandwiching structure that enhances the packing's effectiveness.
Another patent details a method for manufacturing this packing. The process involves determining the types of gas and liquid for gas-liquid contact, calculating the relationship between contact angles and liquid film length ratios, and confirming the flow direction length of the rib within specified parameters. This method aims to optimize the packing's performance in various applications.
Career Highlights
Kenji Tokuda has worked with prominent companies such as IHI Corporation and Kobe Steel, Ltd. His experience in these organizations has contributed to his expertise in packing technology and innovation.
Collaborations
Throughout his career, Kenji has collaborated with talented individuals, including Yoshiyuki Iso and Jian Huang. These partnerships have fostered a creative environment that has led to the development of his innovative patents.
Conclusion
Kenji Tokuda is a distinguished inventor whose work in packing technology has made a significant impact. His patents reflect a deep understanding of fluid dynamics and innovative design principles. His contributions continue to influence the field and inspire future innovations.