Company Filing History:
2 out of 832,880 Years Active: 2002-2003
Title: Kenji Oosawa: Innovator in Semiconductor Technology
Introduction
Kenji Oosawa is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to fabrication methods.
Latest Patents
One of his latest patents is focused on a fabrication method of wiring substrate for mounting semiconductor elements and devices. This invention adopts an electrolytic plating method in forming the bump, which helps avoid the drawbacks of conventional methods. For instance, it eliminates the need for adopting lead wiring for each wiring. The process involves forming a resist film with a negative pattern for the wiring film and another resist film for the bump or pad on the surface of a metal base. Using these films as masks, electrolytic plating of a bump material film is conducted to form the bump. After the second film is removed, the first resist film is used as a mask for further electrolytic plating to create the wiring film.
Career Highlights
Kenji Oosawa has dedicated his career to advancing semiconductor technology. His innovative methods have the potential to streamline production processes and enhance the efficiency of semiconductor devices.
Collaborations
He has collaborated with notable colleagues such as Tomoo Iijima and Hidetoshi Kusano, contributing to a dynamic work environment that fosters innovation.
Conclusion
Kenji Oosawa's contributions to semiconductor technology through his patents reflect his commitment to innovation and improvement in the field. His work continues to influence the industry and pave the way for future advancements.