Company Filing History:
Years Active: 2025
Title: Kenji Obinata: Innovator in Semiconductor Packaging
Introduction
Kenji Obinata is a notable inventor based in Nagoya, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the design and development of innovative semiconductor packages. His work is characterized by a focus on enhancing the efficiency and functionality of semiconductor devices.
Latest Patents
Kenji Obinata holds a patent for a semiconductor package that features a substrate body made of an insulating material with a frame shape and a through hole. This innovative design includes a heat-dissipating member made of a metallic material, which has a top face serving as an element-mounting surface positioned within the through hole. The joining of the substrate body and the heat-dissipating member is achieved using a joining agent, ensuring optimal thermal management for semiconductor applications. He has 1 patent to his name.
Career Highlights
Obinata is currently associated with Niterra Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work at Niterra has been instrumental in developing advanced packaging solutions that meet the growing demands of the electronics industry.
Conclusion
Kenji Obinata's contributions to semiconductor packaging exemplify the innovative spirit of modern technology. His patent reflects a commitment to improving the performance and reliability of semiconductor devices, making him a key figure in this field.